Special Reports

Flash Getting Stacked High-Bandwidth Version

By: Bryon Moyer

Inspired by HBM, HBF could improve AI efficiency in 3D flash memory.
Humanoid Touch And Voice Are Improving Rapidly

By: Liz Allan

General-purpose humanoid robots need all their senses to function equally well; vision and movement are the farthest along, but others...
Foundry Capacity Is Limiting Who Competes At Leading Edge Nodes

By: Ann Mutschler

But the inability to utilize leading-edge process nodes has created opportunities for small and midsize chip developers in multi-die design,...

 more »

Top Stories

With Chiplets, What Role Does Economics Play?

 Costs can rise with chiplets. Will that change? Will it matter?
May 21st, 2026 By Bryon Moyer

Low-Temp Solders Are Suddenly Critical For Chiplets And Photonics

 Warpage, heat, and brittleness can cause huge reliability problems for expensive designs.
May 21st, 2026 By Laura Peters

Mask Technology Faces A New Set Of Challenges

 Inspection limits, curvilinear adoption, data volumes, and high-NA EUV are converging t...
May 21st, 2026 By Gregory Haley

Options Grow For Standardizing Data Movement And Sharing Resources

 But figuring out which ones to use, and when to use them, isn't always clear.
May 20th, 2026 By Ed Sperling

Confusion Grows With More Interconnect Options And Tradeoffs

 Each standard serves a specific use case, so chip architects are choosing more than one...
May 18th, 2026 By Liz Allan

Chiplets Need A New Workflow

 Multi-die assemblies are facing full system-level challenges, but engineering teams nee...
May 14th, 2026 By Ann Mutschler

Gates Add Functionality, But Wires Create Problems

 Wires are treated as a lesser concern, but their neglect is becoming critical at advanc...
May 14th, 2026 By Brian Bailey

AI Accelerator Testing Depends On DFT Innovations

 Multi-die assemblies greatly increase the number of things that can go wrong, and the d...
May 12th, 2026 By Laura Peters

Smart Test Collides With The Data Chain

 Increasing complexity is limiting the ability of machine learning models to effectively...
May 12th, 2026 By Gregory Haley

HBM Shifts Testing Left To Preserve AI Chip Yield

 Testing sooner and more often can improve quality and reduce scrap, but it's also more ...
May 12th, 2026 By Anne Meixner

Building AI Without Guardrails

 The semiconductor ecosystem is wrestling with fragmented standards, IP exposure, and th...
May 7th, 2026 By Ann Mutschler

Next-Gen Batteries Require Impedance Data And Active Balancing

 Battery management systems are growing increasingly smarter with innovations in softwar...
May 7th, 2026 By Liz Allan

Using AI To Monitor Dashboards In Chips And Systems

 AI agents can be used to identify potential issues during operation and react before it...
May 6th, 2026 By Ed Sperling

Designing Chips In The Context Of Rapidly Evolving AI

 Long‑running agents, tool-calling LLMs, and multimodal chaos are rewriting edge compu...
May 4th, 2026 By Ann Mutschler

Creating Agentic EDA Methodologies

 Current approaches involve multiple tools, vendors, designs, data formats, and abstract...
April 30th, 2026 By Brian Bailey

NoC Coherency Challenges Balloon With AI SoCs And Chiplets

 Complex chips need coherent and non-coherent sub-NoCs to ensure efficient data paths. C...
April 30th, 2026 By Liz Allan

How Long Will CAN Stick Around As Rival Networks Speed Up?

 New in-vehicle networking technology will likely take over as more AI is added, but in ...
April 29th, 2026 By Liz Allan

When Semiconductor Materials Misbehave

 The gap between lab performance and fab reality is growing wider as packages grow more ...
April 27th, 2026 By Gregory Haley

Can Edge AI Keep Up?

 As models evolve faster than silicon cycles, experts weigh how much adaptability archit...
April 23rd, 2026 By Ann Mutschler

Chiplet Standards Aim For Plug-n-Play

 They're necessary, but insufficient for a marketplace.
April 16th, 2026 By Bryon Moyer

more top stories »

Latest News

Blog Review: May 20

 Importing functions in PSS; rethinking server architecture; HBM challenges; heterogeneous integration roadmaps; sparse linear algebra.
May 20th, 2026 By Jesse Allen

Chip Industry Week in Review

 Tata-ASML deal; what happened to H200 chips for China? $1.5T IC industry by 2030; new funding; AI memory tools; MRC spec; embedding solar chips in windows; Ford l...
May 15th, 2026 By The SE Staff

Blog Review: May 13

 GPU rasterizer for computational lithography; restructuring techniques; inline memory encryption; automotive electronic stability program.
May 13th, 2026 By Jesse Allen

more news »



Opinion

Lasers Are The Heartbeat Of The Optical AI Data Center

 These III-V semiconductors are essential for super-high-bandwi...
May 13th, 2026 By Geoff Tate

Hardware From Specifications Using AI

 Can AI really generate hardware from specifications? It may no...
May 6th, 2026 By Brian Bailey

more opinions »



Research

Research Bits: May 19

 Photonics: Programmable PIC; small optical features in hydroge...
By Jesse Allen

Chip Industry Technical Paper Roundup: May 19

 Micro-transfer printing for silicon photonics; 2D electronics ...
By Linda Christensen

Research Bits: May 11

 Non-destructive terahertz inspection; piezoelectric step-down ...
By Jesse Allen

more research »



Startup Corner

Startup Funding: Q1 2026

 Massive rounds for AI, EDA, and manufacturing; 80 startups rai...
By Jesse Allen

Startup Funding: Q4 2025

 More and bigger funding rounds for AI chips and AI for making ...
By Jesse Allen

more startups »

Videos

DFT In Automotive

May 13th, 2026

New CPU Memory Module

April 28th, 2026

System-in-Package Challenges

April 23rd, 2026

Why Proof Convergence Matters

April 20th, 2026

Knowledge Centers / Entities, people and technologies explored

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