Special Reports

When The Test Cell Lies

By: Gregory Haley

As margins shrink and dies move into expensive packages, separating device failures from test-cell artifacts has become a first-order economic...
Rethinking Chip Verification

By: Ann Mutschler

Specification engineering is gaining traction as a potential solution to the verification bottleneck.
Creating A Moore’s Law For AI Scaling

By: Laura Peters

Scaling AI becomes the grand challenge of the Intelligence Era.

 more »

Top Stories

From Highways To Health Care: Portability Proves Key To Physical AI

 Success at the edge takes advantage of common threads — lithography, imaging, chiplet...
July 22nd, 2026 By Laura Peters

Data Center Chokepoints Tied To AI, Political Pressure, Supply Chain

 Technical, political, and supply chain challenges are complicating data center buildout...
July 20th, 2026 By Brendan Heffernan

Can Fine-Pitch Hybrid Bonding Go High Volume?

 Hybrid bonding already works in production, but finer-pitch die-to-wafer integration mu...
July 16th, 2026 By Gregory Haley

New Nonvolatile Memory Winners Emerge

 RRAM, MRAM have promising futures, while FeRAM lurks, and UltraRAM plans a debut.
July 16th, 2026 By Bryon Moyer

Alternative Materials For Hybrid Bonding

 Nanotwinned copper, SiCN, BCB, and passivating metals are all possibilities
July 16th, 2026 By Katherine Derbyshire

AI In Chip Design: Lots Of Promise, Plenty Of Unanswered Questions

 Where AI will be successful, who will benefit, and how that will affect the design proc...
July 15th, 2026 By Ed Sperling

Startup Funding: Q2 2026

 Plenty of cash for AI and its enablers; 80 startups raise over $6B.
July 13th, 2026 By Jesse Allen

AI Is Rewriting The IP Playbook

 As the semiconductor ecosystem pivots to AI, it is transforming how IP is created, veri...
July 9th, 2026 By Ann Mutschler

Where Does Quantum Computing Stand?

 It's slowly emerging from research and heading toward high-volume production.
July 9th, 2026 By Bryon Moyer

An AI Model Fit For Purpose

 Using models outside the context in which they were created for can result in misleadin...
July 9th, 2026 By Brian Bailey

Multi-die Testing In The Field Must Build On Established Test Methodologies

 Having a device that works at time zero is no longer a guarantee of reliability over it...
July 7th, 2026 By Laura Peters

Inspection And Metrology Catching Up For High-Density Fan-Out Panel Packaging

 Optical methods need to comply with increasing warpage, finer RDL pitch, and trace size.
July 7th, 2026 By Anne Meixner

AI Data Centers And Auto Industry Converge On Same Issues

 The EV revolution relies on battery innovation, while AI data centers need a range of n...
July 2nd, 2026 By Liz Allan

Defending Against AI-Enabled Data Fusion

 As multimodal AI fuses data from billions of devices, attackers can weaponize detailed ...
July 2nd, 2026 By Ann Mutschler

Fine-Tuning Humanoid Vision And Movement

 Ongoing innovations are enabling humanoids to see and move more like humans; smell and ...
July 2nd, 2026 By Liz Allan

Observability Is A Missing Layer In AI-Era Chiplet Design

 In next-generation silicon, AI can interpret system behavior at scale, but only if obse...
July 1st, 2026 By Ann Mutschler

I/O Design Challenges Grow In AI Data Centers And HPC Clusters

 Physical I/Os can be a chokepoint for high-performance chips and high-speed interconnec...
June 25th, 2026 By Liz Allan

Verification Methodologies Struggle To Keep Up With AI

 Engineers are flooded with new capabilities. The problem now is how best to deploy them.
June 25th, 2026 By Brian Bailey

Executive Outlook: Agentic AI’s Impact On Chip Design

 Can engineers trust AI to get everything right in semiconductor design and verification?
June 25th, 2026 By Ed Sperling

Mask Economics Shape High-NA EUV Adoption

 Rising mask costs, tighter high-NA requirements, and new materials challenges are forci...
June 22nd, 2026 By Gregory Haley

more top stories »

Latest News

Blog Review: July 22

 Securing physical AI; agents need feedback; 3D-IC security; chiplet interoperability; RF digital twins.
July 22nd, 2026 By Jesse Allen

Chip Industry Week In Review

 Intel's expansion; Cadence AI super agent for PCB, advanced packaging; photonics fab wars; earlier Yongin fab; German funding; new CHIPS Act award; HBM standard; ...
July 17th, 2026 By The SE Staff

Blog Review: July 15

 PCIe ATS verification; physical AI; adopting AI EDA; custom AMBA Viz plugins; V2G; fab construction workforce.
July 15th, 2026 By Jesse Allen

more news »



Opinion

Change Is Tough

 There has never been a time when change has become something e...
July 13th, 2026 By Brian Bailey

Data Center AI Growth Faces Challenging Bottlenecks

 Will AI growth grind to a halt due to bottlenecks?
July 6th, 2026 By Geoff Tate

more opinions »



Research

Chip Industry Technical Paper Roundup: July 21

 Near-memory HBM for LLM inference; processing-in-memory for 3D...
By Linda Christensen

Research Bits: July 21

 Thin TMD transistors; diamond defect detection; roll-to-roll l...
By Jesse Allen

Research Bits: July 14

 Cerebellum-inspired memtransistor; fungal mycelium PCB; doping...
By Jesse Allen

more research »



Startup Corner

Startup Funding: Q2 2026

 Plenty of cash for AI and its enablers; 80 startups raise over...
By Jesse Allen

Startup Funding: Q1 2026

 Massive rounds for AI, EDA, and manufacturing; 80 startups rai...
By Jesse Allen

more startups »

Videos

Verifying Networks On Chip

July 20th, 2026

AI Models On The Edge

July 14th, 2026

How Far Left Can You Shift?

June 24th, 2026

New USB Standards: Benefits And Incompatibilities

June 23rd, 2026

Knowledge Centers / Entities, people and technologies explored

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